Creating a prosperous future
with cutting-edge technologies.
We contribute to realizing a sustainable future
through high-quality manufacturing.
HAL Research always keep improving ourselves towards innovation.
Our Technology
HAL Research provide solution of Polishing, Cleaning,
Bonding and Trial Production of implementation and Test.
Polishing
We create Super smooth surface using tailored process depending on various wafer materials.
Cleaning
We create cleanness of wafers to satisfy as the pre-bonding quality.
Bonding
We provide Direct bonding, and coating technologies which are originally developed Tohoku university, Tanaka lab.
Thinning
After bonding, we reduce the thickness of wafers down to your designated thickness. (e.g: thickness 0.5μm~200μm)
Trial/Test
We also offer the trial production of MEMS devices and quality test.
Corporate Profile
To deliver quality that exceeds expectations, expert team with rich experience and knowledge keep development.
We value not only the latest technology, but also the user's point of view.
We also value consideration for the global environment.
Company name | HAL Research Co. Ltd |
CEO | Yuko Akabane |
CTO | Shuji Tanaka (PhD. Engineering) |
CTO | Michio Kadota (PhD. Engineering) |
Office | 24-15 aza chojamae iidoi Rifucho Miyagi, 981-0113 JAPAN |
Services | Precision manufacturing, MEMS devices, MEMS process development, |